PART |
Description |
Maker |
AP2301EN-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE
|
Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited]
|
POWERSO-10 |
10LEADS POWER SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
AP2318GEN-HF AP2318GEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp. Advanced Power Electronics ...
|
AP2607AGY-HF AP2607AGY-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp. Advanced Power Electron...
|
AP2609GY-HF AP2609GY-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE 小外形L -引线封装
|
Fujitsu Limited Fujitsu, Ltd.
|
FPT-28P-M17 |
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC 小外形L -引线封装28引脚塑料
|
Fujitsu Limited Fujitsu, Ltd.
|
AP2310GN |
Simple Drive Requirement Small Package Outline Surface Mount Device
|
TY Semiconductor Co., Ltd
|
SOT340-1 |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
AP2318AGEN-HF AP2318AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package, Surface Mount Device
|
Advanced Power Electronics Corp. Advanced Power Electronics ...
|